Qualcomm College Intern/Co-op for 2018 - Hardware Engineering Careers - QCT, Cork, Ireland in Cork, Ireland
Job Id E1957953
Job Title College Intern/Co-op for 2018 - Hardware Engineering Careers - QCT, Cork, Ireland
Post Date 08/14/2017
Company-Division Qualcomm Technologies, Inc.
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
Job Area Engineering - Hardware
Location Ireland - Cork
Job Overview Qualcomm CDMA Technologies, a.k.a. QCT http://www.qualcomm.com/qct/, is the industry leader in 3G and 4G communication technology, the largest fabless semiconductor company in the world and is consistently ranked among Fortunes 100 Best Companies to Work For.
QCT offers solutions for CDMA, UMTS, GSM and LTE technologies, providing support for both 3G and 4G networks and devices. Qualcomm also offers a broad portfolio of additional wired and wireless technologies for the mobile, networking, computing and consumer electronics product segments. Our combined portfolio now features an expanded array of high-performance, end-to-end solutions ranging from Wi-Fi, GPS, Bluetooth, FM and Ethernet to HomePlug Powerline and passive optical network (PON) technologies.
All of our solutions and products are elegantly engineered for optimal performance and power consumption. And our system-on-chip solutions like Snapdragon bring together CPU, GPU, connectivity, multimedia and GPS technologies in a way that is redefining mobile possibilities for people everywhere. Because of its unsurpassed performance and capabilities, Snapdragon is enhancing the mobile experience and fueling an ever-expanding array of new connected device categories, ranging from smartphones to tablets to e-readers and beyond.
At Qualcomm, the sky's the limit. College Interns/Co-ops a play important roles now and in the future for the company. Many of our 30,000+ employees join us right out of college because were working at the cutting edge in wireless. The world's wireless devices are shrinking at incredible rates, and as a hardware engineer, you will be tasked to design the next warp-speed processor, minute circuit or ultra-low-power radio to maintain Qualcomm's position as the world's leading wireless company.
We are looking to recruit Interns/Co-ops for Qualcomm to start in Summer 2018 for 10-12 weeks.
Digital ASIC Design
Minimum Qualifications Relevant skills include experience with:
Design, Coding and Scripting: Verilog or VHDL, C/C++, Python, Tcl/Perl/shell-scripting
Verification Methodology using System Verilog/OVM/UVM
Project work with FPGAs
Knowledge of Low Power Design
Knowledge of wireless/wired communications and protocols, graphics/video multi-media, ARM processors or security algorithms is a plus.
Strong Interpersonal, communications and teamwork skills required.
Excellent computer skills (Including, but not limited to: Windows, Office, Visio, MS Projects)
Dedication to successful and thorough completion of assigned tasks.
Preferred Qualifications Enrolled in a Bachelors degree in Electrical Engineering or Computer Engineering.
Coursework in the following areas: Circuits and Electronics, Signals and systems, Microelectronic Devices and Circuits, Semiconductor Devices, Feedback systems, Digital Integrated Circuits, Digital Signal Processing, Low power VLSI, Semiconductor Physics, Software Programming.
Prior Work experience not required
Education Requirements Enrolled in a Bachelors degree in Electrical Engineering or Computer Engineering.
EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.